Di Xing Jing Products files-English

New Thermal Products

2024

High Power Graphene /Ultrathin Vapor Chamber /Graphene Super / Conductive Copper / Cooling Copper Foil / Cooling Material

Company Introduction

    Di Xing Jing Science Technology Co., Ltd. is a national high-tech enterprise specializing in R&D, production and sales of thermal conductive products. The products provide a full range of services for new electronic products such as mobile communications, medical treatment, energy storage, new energy vehicles, intelligent vehicles, artificial intelligence, and GPU heat dissipation. The company has a number of utility models and invention patents for heat conductivity and heat dissipation and has passed the ISO9001 international quality management system and technology-based small and medium-sized enterprises.

    Since its establishment, the company has gradually expanded its scale. The company now has a clean workshop and working environment. Our superb professional and technical team and high-precision production equipment are able to provide customers with effective and efficient service. In line with the corporate philosophy of "integrity, innovation, service, and win-win", we achieve the purpose of mutual benefits and common prosperity with customers and sustainable management, growth and development together with employees. 

Production Equipment

CONTENTS

Super Conductive

          Copper

01

Cooling Copper

         Foil 

02

Conductive 

Heat Pipe

04

05

06

Hilghly Conductive

       Graphene

03

Cooling Material

 Vapor Chamber

01

Super Conductive Copper

Material Introduction

02

01

03

04

 

 Easy processing and welding performance, corrosion resistance and low temperature performance are good, tensile strength: 245-345 (MPA), melting point is 1100 ℃

60um Super 

Conductive Copper

70um electrolytic

 copper

Performance

 comparison

Feature Test

60.55*32.1*0.8mm

heat dissipation of 5G routers

Terminal: Huawei

Super Conductive Copper

133.5*70*0.4MM

vapor chamber

58*50*0.4MM

Room temperature: 25°C

Heating end: 20mm 

starting temperature 100°C 

heat dissipation of laptops

Terminal: Pinwang

heat dissipation in notebooks

Terminal: Asus

Effect：T1--T2: 2.6℃

Room temperature: 25°C

Heating end: 20mm

starting temperature 100°C 

Effect：T1--T2: 43℃

Effect：T1--T2:3.3℃

Room temperature: 25°C

Heating end: 20mm

starting temperature 100°C 

60um 超导铜箔

300um 石墨烯

40um 控温铜箔

Super Conductive Copper

02

Cooling Copper Foil 

& Cooling Material

These materials can quickly conduct heat to XYZ three axes at the same time, because it contains PCM components to absorb heat.

The cooling time is less, which improves the overall 

heat dissipation effect of the motherboard.

◆ Endothermy

◆ Gasification

                  Size：80*30*0.03mm

After the phase, the end temperature is34.1℃

                Size：80*30*0.04mm

After the phase, the end temperature is 30.5℃

◆ Endothermy

◆ Heat storage

◆ Endothermy

◆ Liquefaction

Product Features

Cooling Copper Foil 

 （1）This Copper foil belongs to soft electrolytic copper (purple copper, single rough surface), has the function of excellent heat conduction, phase change and heat dissipation. 

 （2）This conductive copper foil has very low impedance, good adhesion and shielding effectiveness

 （3）It is suitable for FCC and CE certification standard display, desktop computer, notebook computer, mobile phone, and other communication equipment

 （4）This product should be placed in a warehouse with constant temperature and humidity,where should avoid high temperature, high humidity and sunlight. The room temperature should be controlled between 20 and 26 degrees, and the humidity should be between 50% and 65%. The principle of first in first out should be followed.

Product Features

Cooling Material

（1）Thin material；store heat to control the temperature；as soon as the temperature arrives at 37℃，

it turns into liquid to spread the heat; suitable for thin, small gap products 

（2）High temperature resistance, high strength, stable chemical property.

（3）Low thermal resistance, light weight, excellent conductive properties, electromagnetic shielding effect 

（4）High thermal conductivity ；it can smoothly attach to any planet and curved surface ( pay attention to the short circuit and ESD problem) 

60um 超导铜箔

300um 石墨烯

40um 控温铜箔

60um 超导铜箔

300um 石墨烯

40um 控温铜箔

Room temperature: 25°C

Heating end: 20mm

starting temperature 100°C  

Effect：T1--T2   15.9℃

Size：80.8*42.35(18)*0.4mm

Size：75 * 18* 0.4mm

starting temperature 100°C   

Effect：T1--T2  9.6℃

03

Hilghly Conductive 

Graphene

    

  Graphene is an allotrope of carbon in which carbon atoms are hybridly bonded to form a single layer of hexagonal honeycomb lattice graphene. 

  [1] Graphene can be used as a crystal structure to construct fullerenes (C60), graphene quantum dots, carbon nanotubes, nanoribbons, multi-walled carbon nanotubes, and nanohorns. Graphite is formed when graphene layers (>10 layers) are stacked together, and the layers are held together by van der Waals forces with a spacing of 0.335 nanometers. [1- 

  [2] Graphene has excellent optical, electrical, and mechanical properties, and has important application prospects in materials science, microfabrication, energy, biomedicine, and drug delivery, and is considered to be a revolutionary material in the future.

Material Introduction 

Features Test

300um Graphene

200um Graphene

100um Graphene

Room temperature: 25°C

Heating end: 20mm

starting temperature 60°C

Effect：T1--T2：13.6℃

Room temperature: 25°C

Heating end: 20mm

starting temperature 60°C

Effect：T1--T2 ：8℃

starting temperature 60°C   60℃ 

Effect：T1--T2：6.4℃

Material parameters

Thermal conductivity            ASTM-E1461         X&Y : ≥1000-1600w/(m·k)   Z: ≥ 12w/(m·k)

electrical conductivity              ASTM-C611            10000s/cm

Specific heat capacity/50℃     ASTM-E1269          0.85J/(g ·K)

 Times of folds (180° bend)          ASTM-D2176          ≥ 10000 times

tensile strength                            ASTM-D882          X&Y : ≥25MPa    Z:≥0. 3MPa

Operating temperature（℃）     ASTD4881M-          -55~400℃

04

 Vapor Chamber

Vapor Chamber

      VC（Vapor Chamber）The full name is vacuum vapor chamber heat dissipation technology. The basic principle of heat dissipation is similar to heat pipe heat dissipation, and it also uses the phase change of water to circulate heat dissipation. When the heat source conducts heat to the evaporation zone, the coolant (mainly water) in the chamber is heated in a low vacuum environment for vaporization, at this time, the heat energy is absorbed and the volume expands rapidly, the gaseous coolant quickly fills the entire chamber. When the gas comes into contact with the cooler area, it will condense into a liquid state. The previously absorbed heat is removed through the coagulation process, and the condensed coolant is returned to the evaporation zone through the microcapillaries, where the process repeats itself in the chamber. VC vapor chamber heat dissipation is similar to heat pipe heat dissipation in principle. The difference is that heat pipes only have a "linear" effective thermal conductivity in a single direction, while VC vapor chambers are equivalent to an upgrade from "line" to "surface", which can transfer heat in all directions and effectively enhance heat dissipation efficiency. According to the online data, the thermal conductivity of heat pipe heat dissipation is 5000–8000 W/(m.k), while vapor chambers have a larger cavity space than heat pipes, which can accommodate more actuating fluids, and can reach more than 20000 W/(m.k). At the same time, the VC vapor chamber has a larger heat dissipation area, which can cover more heat source areas to achieve overall heat dissipation. In addition, the VC vapor chamber is thinner and lighter, which is more in line with the current development trend of lighter and thinner mobile phones and maximizing space utilization.

Features Test

Size:   91.5 * 55.1 * 0.35 mm

Room temperature: 25°C

Heating end: 20mm

starting temperature 60°C   

Effect：T1--T2 :0.6℃

Mobile phone usage scenarios

1，Customized shape and       controllable structure 

2，Optional upper and lower lid materials (copper, stainless steel, titanium alloy)

3， High thermal conductivity and the heat dissipation area is larger.

4， The thickness is extremely thin, up to 0.25mm.

05

Conductive Heat Pipe

Product Introduction

        When the evaporation section of the heat pipe is heated, the liquid working fluid in the capillary absorbent core evaporates, and the pressure difference between the "hot" evaporation section and the "cold" condensation section drives the steam to flow into the condensing section and condenses in the condensation section. The working fluid that changes back to liquid flows from the condensation section back to the evaporation section along the capillary structure driven by capillary force. And so on, and the heat is transferred from one end of the heat pipe to the other. Different application environments and usage conditions require micro heat pipes to have different heat transfer properties and structures. The heat transfer performance of microheat pipes is closely related to the capillary wick structure on its inner wall, so the design and manufacturing technology of wick structure has always been the key and difficult point in the manufacturing process of microheat pipes. According to the structure of the wick, there are three types of micro heat pipes: trench micro heat pipes, sintered micro heat pipes and composite micro heat pipes. In addition, there are flat plate heat pipes. Micro heat pipes are characterized by light weight, simple structure, large heat transfer, fast speed, long durability and long life, easy storage and storage, and no power consumption.

DVC 65（72 .75. 78. 80）.7.8.04

DVC 78.6.1.04

DVC 46.3.04

Room temperature: 25°C

Heating end: 20mm

starting temperature 100°C   

Room temperature: 25°C

Heating end: 20mm

starting temperature 100°C   

Room temperature: 25°C

Heating end: 20mm

starting temperature 100°C   

Straight pipes

Bent pipes

Small Bent pipes

Effect：T1--T2:  2℃

Effect ：T1--T2: 2.1℃

Effect：T1--T2:  3.7℃

Features Test

06

Graphite

Product Introduction

       Artificial graphite is a heat dissipation film with higher thermal conductivity (three times more than that of natural graphite), faster heat transfer, thinner thickness and lighter weight than natural graphite, which can be well compounded with various adhesives and insulating films, die-cut into various shapes and sizes.

 Smartphones；

Product Applications

Feature Test 

Die-Cut  products

Thickness: 17um 

Thickness: 25um   

Thickness: 40um

Size：80*30*0.017mm

starting temperature 100°C   

Effect：T1--T2≤ 26℃

Size：80*30*0.025mm

Room temperature: 25°C

Heating end: 20mm (60℃)

Effect：T1--T2≤ 23℃

Size：80*30*0.07mm

Room temperature: 25°C

Heating end: 20mm (60℃)

Effect：T1--T2为≤15℃

Size：80*30*0.04mm

Room temperature: 25°C

Heating end: 20mm (60℃)

Effect：T1--T2≤21℃

 Artificial graphite

Thickness: 70um

Di Xing Jing Thermal Technology

Material R&D, die-cutting production, vapor chamber production, thermal simulation design.   

Thermal solution provider  

website: www.dixon-tc.com